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標題 (1-12 之 141)
0549
1 A front-end wafer-level microsystem packaging technique with micro-cap array [electronic resource] Chiang, Yuh-Min Electronic Resources
   
2 Activity-based cost modeling and dynamic simulation study of an international reusable packaging sys Kim, Jongkyoung Electronic Resources
   
3 An adaptive tabu search approach to cutting and packing problems [electronic resource] Harwig, John Michael Electronic Resources
   
4 Adhesion and subcritical debonding of polymer/inorganic interfaces in the absence of threshold [elec Sharratt, Bree M Electronic Resources
   
5 Adhesion mechanisms of nano-particle silver to electronics packaging materials [electronic resource] Joo, Sung Chul Electronic Resources
   
6 ALD Enabled Wafer Level Polymer Packaging for MEMS Zhang, Yadong Electronic Resources
   
7 An analysis of factors affecting the cost of returnable logistical packaging systems [electronic res Lee, Sangjin Electronic Resources
   
8 Analysis of package labeling: An evaluative tool to compare cost structures and implementation of p Kiyak, Irem Aydinsoy Electronic Resources
   
9 Analytical concepting for integrated material handling systems [electronic resource] Eldemir, Fahrettin Electronic Resources
   
10 Analyzing and improving viscoelastic properties of high density polyethylene Ahmed, Reaj Uddin Electronic Resources
   
11 Anisotropy of low dielectric constant materials and reliability of copper/low-k interconnects [elect Cho, Taiheui Electronic Resources
   
12 Antimicrobial activity of chitosan impregnated into packaging films and chitosan in solution [electr Park, Su-il Electronic Resources
   
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